The leading chip-making company in the world, TSMC, has announced that it will be investing $100 billion in the United States of America to expand its semiconductor production in the country. The investment is planned to go towards building five state-of-the-art fabrication facilities, adding towards the commitments the company has already made in the country.
Speaking at the White House alongside the Chief Executive of TSMC, C.C. Wei, Trump hailed this announcement as another major investment made in the US ever since his return in the office. C.C. Wei also shared his views and said, “We are going to produce many chips to support AI progress, and to support smartphone progress.”
Much of the funding is expected to pour into Arizona, where the company has already made a hefty investment worth $65 billion to set up a chip-making plant during Joe Biden’s administration, which became functional in late 2024. Now, the company has said that they will set up 3 additional fabrication plants, two advanced packing facilities and a research development centre, which are poised to generate around 400,000 jobs in the next four years.
Taiwanese authorities announced on Tuesday that they would assess TSMC’s investment in the United States to ensure it aligns with national semiconductor industry priorities. “This evaluation will be conducted in compliance with legal regulations,” stated cabinet spokeswoman Michelle Lee, emphasizing that the government would balance the company’s expansion with the broader goal of maintaining the sector’s competitive edge.
You Might Also Like: How Much Do Trump’s Tariffs Raise Prices?
Lee also underscored Taiwan’s crucial role in its technological alliance with the United States. “Taiwan’s collaboration with the U.S. in high-tech industries has positioned it as a vital partner in supporting America’s leadership in advanced technology,” she remarked.
Numerous individuals think that this directly results from Donald Trump’s tariffs and companies’ reluctance to pay high tariffs in their largest market.
